Intel X299 AORUS Motherboard with 12 Phases Digital VRM, Fins-Array Heatsink with 6mm heatpipe, 2.5GbE LAN and Intel LAN, 802.11ac Wireless with High Gain Antenna, Triple M.2 with Thermal Guards, ESS SABRE 9218 DAC, Front & Rear USB 3.1 Gen 2 Type-C Supports 9th Gen Intel® Core™ X Series Processors Quad Channel Non-ECC Unbuffered DDR4, 8 DIMMs Intel® Optane™ Memory Ready 12 Phases Digital VRM Solution with Smart Power Stage Advanced Thermal Design with Fins-Array and 6mm Heatpipe Realtek 2.5GbE onboard and Intel® Gigabit LAN with cFosSpeed Onboard Intel 802.11ac 2x2 Wi-Fi & AORUS Antenna 130dB SNR AMP-UP Audio with High-End ESS SABRE 9218 DAC, ALC1220 and WIMA audio capacitors USB TurboCharger for mobile device faster charging support RGB FUSION with Multi-Zone RGB LED Light Show design, support Addressable LED & RGB LED strips Smart Fan 5 features Multiple Temperature Sensors and Hybrid Fan Headers with FAN STOP Front USB 3.1 Gen 2 Type-C™ Header Triple Ultra-Fast M.2 with PCIe Gen3 x4 interface with Triple Thermal Guards USB DAC-UP 2 with Adjustable Voltage DESIGN CONCEPT WINGS OF EXCELLENCEThe falcon utilizes its powerful wings to soar through the skies and lock down its prey. The AORUS Core takes inspiration from the falcon's aerodynamic wings, incorporating a multi-layered design which features wing shaped contours and also resembles the falcon's high velocity ascension and dive through the skies. With sleek and metallic armor, the AORUS Core symbolizes advancement in technology with its futuristic style. AORUS PERFORMANCE12 Phase Digital Power DesignX299 AORUS MASTER motherboard uses an 12 phase digital CPU power design which includes both digital PWM Controller. These 100% digital controller and additional 8+8 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new 9th Generation Intel Core processors.Fins-Array Heatsink with 6mm Heatpipe and High Thermal Conductivity Pad X299 AORUS MASTER uses Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pad, it can transfer 2.7x more heat than traditional thermal pads in the same time period. 6mm Heatpipe helps to transfer heat between two heatsinks which improves overall thermal balance of the MOSFETs. Fins-ArrayIncrease 300% heat dissipation area compared to traditional heatsink in same size. Active FanBuilt-in active cooling fan for faster MOSFET Heat dissipation; automatically adjust fan speed base on VRM temp. 6mm HeatpipeHeatpipe helps to transfer heat between two heatsinks which improves overall thermal balance of the MOSFETs. High Thermal Conductivity padBy using 1.5mm thicker 5 W/mK thermal conductivity pad, it can transfer 2.7x more heat than usual thermal pad in the same time. Thermal BaseplateBy using thermal pads between PCB back side components and baseplate to transfer heat and dissipate it by large metal plate.Base plate + I/O Shield ArmorDurable design and easy installation With an integrated base plate, GIGABYTE Motherboards give users a strong foundation to build their Gaming PCs.